Using the Influence of Internal Gate Resistance on Gate Current Peak as TSEP for GaN HEMTs | VDE Conference Publication | IEEE Xplore

Using the Influence of Internal Gate Resistance on Gate Current Peak as TSEP for GaN HEMTs

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Abstract:

In this paper a temperature measurement method which is already used for Si-IGBTs is adapted to commercially available GaN HEMTs. This method is based on a temperature de...Show More

Abstract:

In this paper a temperature measurement method which is already used for Si-IGBTs is adapted to commercially available GaN HEMTs. This method is based on a temperature dependency of the internal gate resistance and its impact on the gate current peak during turn on transition.
Date of Conference: 09-11 May 2023
Date Added to IEEE Xplore: 04 July 2023
Print ISBN:978-3-8007-6091-6
Conference Location: Nuremberg, Germany

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