Design and Performance Analysis of High-Precision Infrared Temperature Measurement Device Based on Butterworth Filter for Laser Soft Soldering

Real-time measurement of solder joint temperature and precise adjustment of the output power of the semiconductor laser are crucial to ensure high-quality laser soldering. To prevent solder joint scorching, virtual soldering, and false soldering caused by measurement errors or slow measurement speed, a high-precision infrared temperature measurement device was designed in this study. The principle of infrared temperature measurement is introduced first, followed by a detailed explanation of the main signal processing method used Butterworth filter and the photoelectric conversion circuit design method. Finally, experimental analysis is presented to verify the performance of the device. The results demonstrate that the infrared temperature measurement device designed in this study is suitable for non-contact measurement of laser soft soldering solder joint temperature with an error range of only 2%. This indicates the effectiveness of the device in enabling real-time temperature measurement and precise power control during laser soldering processes.