3D Thin Film Metrology without Cross-Sectional Sampling

Conformal coating in high aspect ratio substrates is a crucial factor in the development of next generation 3D semiconductor devices. Conventional approaches of employing vertical high aspect ratio substrates for conformality studies have usually been restricted by the tedious analytical technique requirements. Here, we present an innovative solution for this problem by introducing lateral high aspect ratio substrates; PillarHall^® LHAR4 silicon test chips together with simple, fast and accurate metrology tools. The current work also reports the non-organic adhesive approach for the integration of these chips in 300 mm wafer aiming at wafer level processing.