Advanced Process Control System for Trench Shape of Power Devices

In the semiconductor manufacturing, the manufacturing equipment is managed via the quality control (QC) in which the shape of the processed feature is checked whether it meets the specification. If the shape is out of the specification, some recipe parameters are modified so that the shape meets the specification. The calculation method of the recipe parameters depends on the know-how of the individual fab engineers, which cause difficulties in the QC. To overcome this problem, we have developed an automatic calculation method of the optimal recipe parameters with Advanced Process Control (APC) system with the stacking model method in order to solve these problems. In the development process, we have also performed comparison of two gap scoring methods. In the on-site demonstration of this system, we have further optimized the exploration method of the recipe parameters.