Hierarchically Porous Metal-organic Framework Composite for Heat Dissipation of Electronic Devices

Modern high power-density electronic devices require effective cooling mechanisms to prevent thermal damage and ensure reliable performance. However, conventional cooling technologies suffer from numerous drawbacks, including high energy consumption, bulky volume, and excessive noise generation. In this work, by constructing a hierarchically porous metal-organic framework (MOF) composite, we proposed a zero-energy-consumption cooling concept for intermittently used electronic devices. An innovative moist-assisted electrospinning method is developed to fabricate hierarchically porous PAN composites (HMC) with ultra-high MIL-101(Cr) loading (75 wt.%) which is the highest MOF content achieved by electrospinning. High MOF content enables an outstanding equivalent enthalpy of 1700 J / g. Moreover, the highly stable HMC contributes to the fast adsorption-desorption kinetics. The HMC shows outstanding cooling capability for a variety of portable electric devices. Compared to the wireless chargers cooled with air or natural means, the HMC-cooled charger exhibits a 43 % and 86 % increase in charging speed, respectively. More significantly, the mass of H M C is less than 1.5 % of these devices. We believe our materials and approach can inspire high-efficiency cooling solutions for a wide range of intermittently operating electronic devices.