Analytical study on stress and strain of power chip laminated structure

According to the theory of elastoplastic mechanics, the stress and strain of die attach structure in the power chip were studied. Combining with constraints and constitutive models, the functional relationships between material property parameters (coefficient of thermal expansion, Young's modulus, Poisson's ratio, etc.), geometric size (material thickness, length and width), environmental temperature, structural stress and strain were established. The correctness of the mathematical model was verified by finite element simulation.