A Temporary Bonding De-Bonding Tape with High Thermal Resistance and Excellent TTV for 3DIC

Hybrid bonding has essential advantages to improving performance and reducing package size for next generation High Performance Computing (HPC) requirements. In fact, however, there is still a challenge that it needs very high temperature such as 250–300 degC for Cu diffusion to perform robust joint between dies. Therefore, not only process equipments but also process materials are required to have high thermal resistance. In this paper, a Temporary Bonding De-Bonding tape which has over 300 degC thermal resistance is introduced. Furthermore, it has so low total thickness variation that it can provide the planarization of bonding surface to perform reliable hybrid bonding.