Fine-pitch <111>-oriented NT-Cu/SiO2 hybrid joints with high thermal fatigue resistance and low contact resistivity

Fine-pitched NT-Cu/SiO
2
hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.