Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process

Novel temporary bonding/debonding system including high heat resistant temporary bonding adhesive and debonding methods with newly developed photonic release by Xe flash light irradiation will be introduced. New temporary bonding adhesive is endurable up to 300 °C and can be easily removed by peeling off after debonding from the support carrier. By adopting the dual layer structure with adhesive layer and metal layer on glass carrier, one-shot Xe flash light irradiation within 5 ms enables debonding cleanly, indicating the increased throughput at debonding step. Process demonstration results of wafer thinning down to 50 μm, fan-out wafer level packaging (FOWLP) will also be shown.