Novel Photo Imageable Film for Interlayer Insulation Application

We had developed the novel photo imageable film for interlayer insulation application. Small vias up to 8 µm could be formed through photo image process, and electroless copper plating could be applied to form copper wiring. This film was superior to epoxy-based interlayer insulating films in that it was easy to open small-diameter vias and did not require desmear process. It was also superior to liquid photo imageable polyimide in that it was less prone to warpage due to its low curing temperature and CTE, and could be formed by film lamination, ensuring surface flatness in a single process.