Heat Transfer Enhancement in Two-phase Immersion Cooling with FC-72

In recent years, the performance of supercomputers and data centers have been remarkably improved, and with this improvement, heat flux of electronic equipment becomes higher. For cooling the high heat flux equipment, boiling immersion cooling is an effective way. To improve the boiling performance to its full potential, the authors utilize a lotus copper joined onto a grooved heat transfer surface. Although the critical heat flux has been improved, the high superheat of the heat transfer surface remains an issue. This study proposes a cross-shaped grooved heat transfer surface to expand the heat transfer surface area and increase the number of bubble nuclei.