Wafer-scale adhesive bonding with hard Benzocyclobutene anchors for wafer assembly and heterogeneous integration

Herein we present a novel method to improve the post-bonding alignment accuracy of substrates assembled via adhesive bonding with Benzocyclobutene (BCB). The method relies on hard BCB anchors to block misalignment. As a result, the alignment accuracy has been improved by an order of magnitude for a wide range of bonding BCB thicknesses (2-16 µm) without influencing the continuity of this adhesive layer.