Curvature measurements to improve polymer integration in microelectronic devices

Thermoset resins are singular in the aim of microelectronics. Exhibiting a high contrast of thermomechanical properties with other materials like oxides or metals, polymers can threaten the mechanical integrity of stacks. Knowing polymer properties allows manufacturers to foresee the compatibility of materials and improve chipsets reliability. The thermally induced curvature approach uses this incompatibility to determine the biaxial modulus and the coefficient of thermal expansion of a film on a substrate. This method can not only check the achievement of the polymers cross-linking, but also estimate their glass transition temperature. In this paper, we show the ability of this technique to, not only, measure those properties at glassy state, but also, for the first time, at rubbery state.