Development of a wafer-level dicing system with controllable pulse femtosecond laser

The cutting of hard-brittle transparent materials is widely used in chip manufacturing, optical manufacturing and many other fields. In order to realize the high-quality wafer-level cutting process of composite glass, a wafer-level dicing system with controllable pulse femtosecond laser is developed in this paper. The system achieves complete control over the pulse in time and space. With the processing advantages of the femtosecond laser Bessel beam, the synchronized time and synchronized position can be flexibly adjusted to achieve better processing results. Through experimental verification and theoretical analysis, the effects of Time Synchronization Output(TSO) and Position Synchronization Output(PSO) on the roughness of the cut samples are studied, and the minimum roughness 800 nm of the cross-section is obtained on the composite borosilicate glass. The results show that the controllable pulse can effectively optimize the cutting process to obtain less roughness and shape error. Controllable pulse cutting expands the processing application range of femtosecond laser Bessel beams, and can derive more cutting processes.