Reliability Challenges from 2.5D to 3DIC in Advanced Package Development

Advanced packaging platforms such as 3DIC and 3D Fabric have encountered increased reliability risks with advanced packaging architectures such as CoWoS (Chip on Wafer on Substrate), InFO (Integrated Fan Out), SoIC (System on Integrated Chips). Material analysis, mechanical, and board/system level reliability tests were conducted to reduce reliability concerns and improve the robustness of 3DIC architecture. To further evaluate the lifetime of these architectures the new extended test duration is implemented. Using the previously mentioned novel testing approaches, technology development can be rapidly improved, and a reference design can be created to meet requirements of customers' products in the future.