Abstract:
Silicon Photonics Chiplets in Package (SCIP) creates a paradigm shift, enabling escape densities in optics that match the core silicon and creating a scalable platform th...Show MoreMetadata
Abstract:
Silicon Photonics Chiplets in Package (SCIP) creates a paradigm shift, enabling escape densities in optics that match the core silicon and creating a scalable platform that meets requirements of future data center and compute architectures.
Date of Conference: 05-09 March 2023
Date Added to IEEE Xplore: 19 May 2023
Print on Demand(PoD) ISBN:979-8-3503-1229-4
Contents 