A Digital Twin to Model the Impact of Etch Profile on MEMS Gyroscope Performance

This paper details the use of a digital twin to model the impact of process variation including etch profile and critical dimension bias on gyroscope quadrature and operating frequencies. The gyroscope presented comprises two mass quartets with electrodes to compensate quadrature and is formed using deep reactive ion etching. Simulated and measured frequencies values agreed to within 5%. Tilt angle variation with die location is determined to better than 0.1° using measured quadrature compensation voltage and the digital twin.