Analysis of EMI Mitigation Techniques in High Speed Printed Circuit Board

To serve the numerous services, today’s wireless communication devices require microwave network systems with multiband and multifunctional capabilities. A growing number of microwave circuits and parts that can handle several frequency bands and larger bandwidths are needed to support the unprecedented systems. The issues in EMI/EMC have grown as a result of research and advances in contemporary wireless network communication equipment. Generally speaking, there are several ways to reduce different EMI issues. Therefore, the necessary tunable and downsized components are required to make these systems smaller, lighter, and less expensive. Most studies on emission measurements have been done in the time domain recently and one of the widely used techniques is the creation of EMI band pass filters. This article presents band pass filters with HIDDS (Hybrid Inter Digital Defected Ground Structure). Additionally, a number of uses for the hybrid S-parameters are provided by fusing Agilent ADS circuit tool and full-wave EM solvers. To provide a complete EM response of the filter construction, 3D EM simulations are performed. The analysis of the simulated findings with the results of previous experiments has revealed that HIDDS (Hybrid Inter Digital Defected ground Structure) provides minimal insertion loss and a larger range of stop band frequencies. Therefore, wireless systems might benefit from the band pass filters with HIDDS that have been proposed.