Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

The integration of reduced state-space models into finite element analysis tools is a key factor in enhancing the practicality of reduced order models. It helps safeguarding the intellectual property and approximating the behaviour of complex systems. This paper introduces a novel thermo-mechanical super-element, which contains the reduced order model and can be easiliy integrated into finite element environment. Application of the thermo-mechanical super-element leads to significant speed up in computational time of the entire finite element model. Furthermore, compared to the full-order finite element model, the super-element shows excellent approximation of the thermo-mechanical behaviour of the original model and has significant implications for the design and optimization of such systems.