Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D reconstruction methodology for the microstructural investigation of the resin-reinforced Ag sintering material from OverMolded Plastic (OMP) packages. Based on the reconstructed models with different sintering parameters (temperature and time), the fraction of Ag and Resin volume distribution, the connectivity of silver particles, and the tortuosity factors were estimated. A 99% connectivity of sintered Ag particles was achieved with various sintering conditions, such as 200°C for 2 hours, 200°C for 4 hours, and 250°C for 2 hours. However, coarsening of Ag particles was promoted when sintered at 250°C. Increasing the sintering time at 200°C had insignificant changes. The estimated tortuosity factor also indicated that sintering at 250°C provides the shortest heat transport path between the semiconductor die and the package substrate. In order to quantify the microstructural findings, the OMP packages’ thermal performance with different sintering conditions (temperature, time, and interconnect thickness) was experimentally assessed. Although the experimental measurements were less sensitive to the effective interface thermal resistances’, the measurement results show a good correlation with the microstructural analysis. Sintering the Resin-reinforced Ag sintering material at higher temperatures (250°C) seems to improve the package thermal performance, and increasing the sintering time at 200°C has a negligible effect.