Extraction and Compensation of Bonding Wires Parasitic Parameter

The inherent parasitic parameters of bonding wires result in impedance mismatch in integrated microwave system. The equivalent circuit of bonding wire is modeled by $\pi$ -type lossless network, and further described by an admittance matrix. The parasitic parameters of multiple bonding wires are extracted by simulation. For impedance matching, a third-order Chebyshev filter section is designed to compensate the parasitic parameters. The section is applied on transition coplanar waveguide transmission line, connected to the MMIC. Results show a significantly reduction of return loss with compensation section applied. Return loss is reduced by 15dB in simulation and 10dB in measurement at 18GHz.