Solution space analysis of high speed interconnects for OC-192 applications

This paper describes the application of a solution space analysis methodology to differential interconnects for FR-4 substrate material. Full-wave frequency domain electromagnetic simulations have been performed to analyse the impact of material properties and manufacturing tolerances on the performance of coupled and uncoupled differential interconnects. In addition, broadband characteristics were also extracted to analyse the signal performance across the wide frequency spectrum. Based on analysis of the simulated results, a design solution space was derived for coupled and uncoupled differential interconnects. This database can be used within the design flow to concurrently meet performance specifications and manufacturability for backplane applications.