Gain Enhancement of Millimeter-Wave On-Chip Antenna Through Low-Cost Packaging Technology

In this paper, a D-band on-chip antenna (OCA) based on 40-nm bulk CMOS technology is designed. The designed OCA is a hybrid structure of slot antenna and PCB package, the package both protects the antenna from external environment and improves the radiation performance of the antenna. The simulated radiation efficiency and gain of the OCA at 140 GHz are 41% and 4.9 dBi, respectively. The OCA occupies 0.5 X 0.5 mm
²
area. The proposed OCA offers compactness, low cost, and high performance, providing a solution for the highly desirable but challenging millimeter-wave integrated circuit-antenna integration system.