Numerical Analysis of Thermal Runaway in Copper-Plated Multifilament Coated Conductor

We have developed a numerical analysis model to simulate the thermal runaway in copper-plated multifilament coated conductors. We combined a circuit model to calculate current distribution in filaments and copper and a two-dimensional heat conduction model to calculate temperature distribution. The thermal runaway simulations of multifilament coated conductor with local defects were performed, and compared with the experimental results to validate the developed model. According to the simulation results, the effect of current sharing on the initiation of thermal runaway was determined.