Application of High Silicon Aluminum Alloy in the Field of Microelectronic Packaging

The application status of high silicon aluminum alloy in the field of microelectronic packaging was reviewed. First of all, the developing status of high silicon aluminum alloy are introduced, and the various preparation methods are compared and analyzed, and the current development status of high silicon aluminum alloy in various countries is briefly introduced. Secondly, the application direction of high silicon aluminum alloy in the field of microelectronics is briefly introduced, and the application of high silicon aluminum alloy in the field of microelectronics packaging is introduced in detail. Finally, the performance of two typical grades of high silicon aluminum alloys used in the field of microelectronics packaging is compared. High silicon aluminum alloy has great development prospect by virtue of its own superior characteristics.