Research on integrated wireless communication and control Microsystems with thick-thin film hybrid technology based on double-sided cavity

In this paper, a wireless communication and control microsystem based on double-sided cavity with thick and thin film hybrid integration is designed. The system adopts the form of fully sealed ceramic and metal mixed double-sided cavity. The digital analog hybrid circuit and RF transceiver circuit are physically isolated in separate cavities. The cavities are electrically interconnected through the coaxial vertical transmission structure surrounded by copper column medium; The substrate adopts BCB/Cu thin film multilayer interconnection technology based on L TCC to realize high-density integration of Microsystems and high-quality signal transmission. The overall dimension of the sample is only 40mm × 40 mm ×10 mm, weighing 40g. The volume is reduced by two-thirds compared with the traditional LTCC single-sided cavity integration. The test results show that the return loss of RF signal transmission of vertical interconnection structure is less than − 20dB and the insertion loss is less than 0.5dB, which meets the requirements of S/X-band signal transmission performance; The functions of data acquisition, processing, modulation and demodulation of baseband digital analog circuit are normal. The transmission power of microwave circuit is 38dBmw; The clutter suppression is no less than 55dBc;The third harmonic suppression is no less than 45dBc, and the reception sensitivity of microwave circuit is no more than − 98dBm.