A High Integrated 3d Packaged 64-Channel TR Module

A 3D packaged 64-channel TR modul with high integration is proposed in this paper. The power divider units, multifunctional chip, three-stage amplifier, attenuator, phase shifter and single pole double throw switch circuits are integrated in a multi-chip module (MCM) with monolithic microwave integrated circuit (MMIC) and surface mount technology (SMT). Multi-layer microwave board is used to implement the routing of DC, control and RF signals. The RF adapter is used to interconnect the different boards. Moreover, in order to solve the compact space requirement of two-dimensional phase-scanning antenna. Technologies such as integrated chip, vertical interconnection and three-dimensional assembly are used. It has the characteristics of high integration, small size, light weight and so on. According to the measured results, in the operating frequency band(13.7Ghz~14.5GHz), the 64-Channel TR module with 3D packaged achieves the receive gain ≥15dB, receive noise figure ≥3.5 and transmit power ≥23dBm.