High Performance 5G mobile SoC Design-Technology Co-Optimization for PPA and Manufacturability with 5nm EUV FinFET technology

We report on Snapdragon ®888 mobile platform. It is the first integrated 5G modem SoC Flagship Platform for premium tier smartphones using 5nm EUV FinFET technology. It exhibits >20% CPU performance gain over its predecessor Snapdragon 865 thanks to a new design architecture and multiple process improvements. Manufacturability was ready in time for mass production start. Product Quality was significantly improved with key process optimization and very low-voltage memory repair enablement. Low voltage operation and low power consumption are also achieved with further Design-Technology-Co-Optimization (DTCO), enabling premium-tier performance experience with integrated 5G and AI mobile SOC platform.