Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

Wafer level Heterogeneous Integration(HI) is enabling the semiconductor industry to continue packing increasing functionality into power-performance-form factor-cost (PPFC) optimized advanced System in Package (SiP) which addresses wide ranging market requirements in 5G/AI-ML/DC/Automotive applications. In this paper, we provide overview of the SiP solutions that we have developed, demonstrated, and envisioned to meet the challenges of design and manufacture of current and next generation semiconductor systems.