Monolithic 3D Integration of Vertically Stacked CMOS Devices and Circuits with High-Mobility Atomic-Layer-Deposited In2O3 n-FET and Polycrystalline Si p-FET: Achieving Large Noise Margin and High Voltage Gain of 134 V/V

In this work, we demonstrate the monolithic 3D integration (M3D) of vertically stacked p-type low-temperature polycrystalline silicon (LTPS) top-gate transistor and n-type back gate oxide semiconductor transistor, similar to a complementary field-effect transistor (CFET) structure, for complementary metal-oxide-semiconductor (CMOS) logic applications, with a low thermal budget of 450°C. High-performance logic devices and circuits (inverter, NAND, NOR) are demonstrated with a high voltage gain of 134.3 V/V and a large noise margin of 0.84 V at V
DD
of 2 V, which are among the best values in reported CMOS inverters by oxide semiconductor n-FET and LTPS p-FET. These devices are enabled by a high electron mobility atomic-layer deposited (ALD) In
2
O
3
as n-channel to balance the high hole mobility of LTPS. The fabricated ALD In
2
O
3
n - FETs exhibit high electron mobility $\gt 100$ cm $^{2} / V\cdot s$ on $\text{SiO}_{2}/\text{Si}$ substrate and mobility of 23.8 cm $^{2} /V\cdot s$ in the n-FET of the M3D CMOS inverter, which is the highest number in reported CMOS inverters with oxide semiconductor n-FETs and LTPS p-FETs.