Ka-Band AiP Array in Mold-on-Mold FOWLP technology

This paper presents a wideband meta-surface Ka-band 1×2 AiP array implemented in Mold-on-Mold Fan-Out Wafer-Level-Packaging (FOWLP) technology. The fabricated sample with a size of 6mmx12mmx0.384mm has a measured return loss of >11.2dB, a measured Gain of 7.2-9.3dBi over 27-31GHz as well as pure V polarizations with very small cross-polarization components. The fabrication stability is also confirmed by the measured performance consistency of samples at different wafer positions.