A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

Electronic components may fail because of non-uniform thermal load, different Coefficients of Thermal Expansion (CTE) among packaging materials, or solder curing shrinkage. Common failures include substrate warpage, structure delamination, and cracking, which reflect the signification of thermal deformation detection for packaging structures. To illustrate the thermo mechanical properties of electronic packages, a non-destructive inspection method combining the projected speckle three-dimensional digital image correlation (3D DIC) technique and infrared thermography (IRT) is proposed. The temperature of each point on the sample surface is obtained by camera calibration, thereby realizing the coupling of mechanical and thermal information. This method can measure out-of-plane displacement without contaminating the sample and adjust the projected speckle flexibly in different applied situations. The inspection system is validated by displacement measurement and chip-heating experiments, and the standard deviation of displacement can be controlled within 1µm.