Attachment of Alignment Fibre on Interposer for Fibre Optic Array Assembly

A pair of dummy fibres positioned onto the interposer with U-groove were used for alignment purpose for photonic integrated circuit (PIC) chip and fibre array attachment. These dummy fibres at both site of interposer can act as a good alignment guide for the PIC chips, and fibre block with fibre array pre-attached. The fibre attachment with ultraviolet (UV) epoxy showed shorter UV time on higher viscosity UV epoxy in this study. Reflow method and thermocompression method for the PIC attachment has been demonstrated. The fibre optic array attachment onto interposer was demonstrated for both with and without fibre block with immediate UV cure. Thermocompression for PIC attachment had achieved good solder joints formation.