Thermal and Warpage Analysis of High Data Rate Interconnect

Thermal, warpage has been a problem in electronics packaging, in particular to micro-electronics the problem is more complex. This paper primarily focuses on warpage occurrence, thermal stresses, and thermal hotspot determination on a high data rate interconnect, called LightKonnect™. The study is conducted analytically, to define the process flow of the assembly, and working conditions, of the LightKonnect™. Material suitability, capacity to withstand a particular process at a given temperature and pressure studies are conducted simultaneously. The LightKonnect™ has optics material present on it, one to collimate the rays and the other to protect the case. The selection of material is based on reflow temperature withstand ability. We consider a finite element approach for thermal and stress/deformation. Warpage to LTCC substrate during IC Flip Die attach, Epoxy curing for optics and VCSEL/PD attachment to substrate. Thermal hotspots are studied during working conditions.