Hybrid Solder with silver hierarchical structure and particle for Synergistic effect in shear strength of die attach behaviour

Electronic packaging attracts wide research interest in modern die-attach technology. The solder is the core component in die attach technology. In this study, the silver hierarchical structure was combined with nanoparticles to improve the shear strength as hybrid solder. The hierarchical structure was synthesized in accordance with the reductant rate by controlling the concentration of hydroxylamine with optimization of scale-up synthesis. The material characteristics were analyzed depending on the size and morphology. The hybrid solder was fabricated consisting of nanoparticle and hierarchical structure, and it compared shear strength with commercial silver pastes. Finally, the shear strength increased by about 20% developed hybrid solder with 40 mM of hydroxylamine molar concentration than to commercial silver paste.