Ultra-Thin Packaging Films for Encapsulation of Mechanically Imperceptible Printed Photovolatics

Owing to the ultra-thin layer thicknesses in thin-film optoelectronic devices, a paradigm of mechanically imperceptible integration of electronics has emerged as an area of active study. Often such devices are comprised of materials susceptible to degradation from exposure to moisture and oxygen. Packaging solutions typically employ glass or flexible encapsulation films deposited on thick plastic substrates, precluding the value of developing mechanically imperceptible functional device components. Leveraging the ability to decouple manufacturing and integration of thin-film devices via a delamination process, herein ultra-thin barrier films are fabricated, characterized and integrated into printed organic photovoltaic devices. Their ability to extend the shelf-life of printed solar cells stored in ambient and elevated heat-humidity conditions are demonstrated, thereby showing the feasibility of fabricating ultra-thin devices that include equivalently thin and lightweight packaging.