Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications

Wide band and low-loss interconnects for millimeter wave applications are discussed in this work. The focus is to avoid using conventional techniques such as bond wires and solder bumps as they require matching networks, and are relatively narrow band. An Aerosol Jet 3-D printing technique is utilized to print the interconnects from the bare die chip to the package. These types of wideband, low-loss interconnects can contribute toward improving the overall RF front end performance. The proposed interconnects can operate over a wide frequency range of dc-50 GHz with reasonable insertion loss.