Strip Form Package Marking Challenges for Small outline Packages

Traceability in the automotive industry is very important due to the large amount of component from different supplier that is used in every vehicle. Parts that are found defective can be quickly identified from which supplier it was sourced and the affected batch of parts isolated effectively. Existing concept of adding traceability onto a clip bonded device is to add marking at Final Test process after unit is is singulated. Strip form package marking in combination with leadframe ID is another method where marked parts still linked with leadframe ID. This paper outlines the development work, challenges and solution of implementing strip form package marking for the smallest size clip bonded packages. The objective of package marker is to add the device information which is called the product code onto the package. The method is using laser marking to engrave the product code onto the molded package while in the strip form. The requirement is that the marking is legible, must be of specified size and confined within certain boundary area of the package. Influencing factors for achieving good marking were investigated. In conclusion, the font type character size the laser marking position was correlated and track width was able to meet the requirements for the clip bonded product code package marking.