Nano-Artifact Metrics Chip Mounting Technology for Edge AI Device Security

In this study, the effect of surface treatment on the boding strength between Quad flat package (QFP) and quartz was investigated for establishing a QFP/quartz glass bonding technique. This bonding technique is necessary to prevent bond failure at the nano-artifact metrics (NAM) chip and adhesive interface against physical attacks such as counterfeiting and tampering of edge AI devices that use NAM chips. Therefore, we investigated the relationship between surface roughness and tensile strength by applying surface treatments such as vacuum ultraviolet (VUV) and Ar/O2 plasma. All QFP/quartz glass with surface treatments such as VUV and Ar/O2 plasma showed increased bond strength. Surface treatment and bonding technology for QFP and quartz glass were established to realize NAM chip mounting.