Printing of Micrometer-Size Features on Complex Substrates for System Integration

We demonstrate the Ultra-Precise Deposition (UPD) technology for system integration and advanced packaging. UPD allows maskless deposition of highly-concentrated metallic (silver, copper, or gold) nanoinks on substrates with complex geometries and different wetting properties. The printing resolution, defined both as the printed feature size and the distance between the features, is in the range from 1 to 10 μm. This is combined with the ink viscosity up to 2,500,000 cP, which corresponds to 85% wt. of solid content. The electrical conductivity of the printed structures is up to 45% of the value corresponding to the bulk material.