A trial for integrating front end circuits on a substrate of SAW device employing ELO film bonding process

This paper presents a preliminary study on the one chip front-end integrated circuit. We discussed the basic problems of co-integration circuit. We also proposed several novel semiconductor coupled SAW functional devices and shown basic characteristics of these devices using circuit simulator. Using the epitaxial liftoff film bonding technology, we fabricated basic test circuits such as pass exchanger on LiNbO/sub 3/ substrate and measured basic characteristics of circuits.