Investigation of Creepage Distances on Printed Circuit Boards for Avionic Applications

Avionic power electronic applications need enormous power densities (10 $\frac{\text{kW}}{\text{kg}} <)$ under high reliability to enable a high level of electrification. An increase in the DC bus voltage and high switching frequencies due to WBGs is unavoidable. An improved level of integration of these WBGs is needed to meet the aviation specific requirements regarding weight. Thus, this paper focuses on determining the breakdown voltage induced by DC voltages on printed circuit boards to show new design possibilities for future.