A Process for Developing Additively Manufactured Interposers for Use in Printed Circuit Boards

Additive manufacturing has seen much growth in the past few years due to many advantages it provides. Although much progress has been made in the field so far, there is still more optimization that needs to be done before it can be used for mass production. Utilizing the strengths of both manufacturing methods, a hybrid approach is discussed in this paper. An additively manufactured interposer is placed inside of a traditionally manufactured printed circuit board (PCB). The interposer connects the board to circuit components via conformally printed interconnects. Due to the low-loss characteristics of the interposer material in the X-Band, they can be used in multi-stack boards with RF components.