Common Failure Analysis Methods and Typical Failure Mechanisms of Integrated Circuits

With the large-scale application of domestic integrated circuits, the quality and reliability of integrated circuits have received greater attention, too. This paper summarized and analyzed the manufacturing process, packaging process, common failure modes and failure mechanism of integrated circuits, so as to help researchers in different industries understanding the quality and reliability of integrated circuits from the practically sides. At present, most integrated circuits used plastic packaging, wire bonding, lead frame for signal transmission, but there were also ceramic packaging, metal packaging, flip chip welding, BGA Solder ball and other technologies applied in integrated circuits interconnect architecture.In this paper, microscopic analysis technology, electrical analysis technology, composition analysis technology, sample preparation technology and structural analysis technology are used to locate the failure position in different types of electronic components, and further analyses were developed, suggestions for improvement and application were given in the end.