Thermal Analytical Modelling of the Heat Transfer Through a Power PCB Dedicated to a High Current Density Modular Converter

This work is based on an innovative converter structure for an automotive application. A major constraint is the cooling. A nondimensionalization and an analytical resolution of a thermal problem applied to power electronics are proposed. A study of the influence of the geometrical parameters on thermal resistance is carried out to understand the underlying phenomena. Two sizing methods are proposed, based on charts calculated from the proposed resolution. An example of an application based on the initial problem is presented and compared to a finite element simulation.