All -Cu-Package (ACP) High-Power GaN HEMT Module Platform for xEV Traction Inverter and High-Speed DC Charger

This paper describes an all-Cu-package (ACP) GaN HEMT high power module packaging platform for xEV main inverter and high-speed DC charger. Cu auxiliary terminals with press-fit features are integrated for easy assembly, Cu clips replace Al bond wires for reliable interconnections and optimized parasitics, pressure-less Cu sintering and insulated Cu substrate technologies are used to remove sol-der joints to improve attachment reliability. Transfer molding with epoxy resin that formulated for xEV applications is used to replace the traditional silicone encapsulant and plastic housing to reduce environment intrusions. The design concept and ACP technology provide an advanced generic platform that is compatible for different voltage (650V to 1200V) and current levels (~100A to ~600A) for different GaN die configurations.