A New Level of Performance: Best-in-Class 900 A and 750 A 1700 V EconoDUAL(TM) 3 Modules with TRENCHSTOP(TM) IGBT7

The semiconductor market continues to push IGBT technologies to reach new levels of power density, robustness, and performance. At the same time, for the new IGBT generation there is always a need for a product that can be designed into devices with minimal effort and that performs well in a variety of applications. Additionally, the IGBT must be suitable for creating a scalable inverter portfolio with optimized system costs. In this publication, a new Infineon TRENCHSTOP(TM) 1700 V IGBT7 technology, and correspondingly, the new best-in-class 900 A and 750 A EconoDUAL(TM) 3 modules are compared with the Infineon IGBT4 technology in terms of electric and thermal behavior using simulations and application-based tests. Chip optimization was considered in the context of applications specific to 1700 V IGBT modules. The results show that modules with the new 1700 V IGBT7 / EC7 technology achieve significantly increased power densities in a wide range of applications.