All Side Optical Chipping Inspection of Dice in a Die Attach Machine at High Throughput

A full optical inspection of dice for electronic components with high reliability needs is proposed. All sides are assessed checking for defects possibly trashing bad dice to mitigate fatal error in operation. The inspection sequence is optimized using an adjustable lens for focusing, thus allowing more than 5'000 units per hour output at high optical resolution better than 6µm/pixel. This study presents detected defects originating from the dicing process using cutting, laser full ablation, and stealth dicing. Distinct features at the sides captured with the up-looking 6 side module are correlated with micrographs proving the capability of this inspection routine.