Leadless sensor packaging for high temperature applications

This paper reports on a sensor packaging method suitable for high temperature applications. Its application for packaging a 6H-SiC pressure sensor is described. Electrical interconnects between the pressure sensor and the pins of the sensor header were made using a metal-glass frits mixture, without wirebonding. Packaged sensors were tested for pressures up to 1000 psi and at temperatures up to 500/spl deg/C.