Wafer level applied near-hermetic protection for semiconductors

Military electronic parts are becoming unavailable. Weapon system designers are forced to use commercial plastic encapsulated microcircuits (PEMs). PEMs are susceptible to moisture related failure mechanisms occurring from long-term exposure to moisture even at very low humidity levels. Weapon systems must operate reliably after long-term dormant storage sometimes greater than 30 years. An Army Aviation and Missile Command Manufacturing Technology program is reviewed that provides a process for a potential near-hermetic wafer level seal for long term moisture exposure protection of PEMs. The process also provides potential benefits to the commercial semiconductor manufacturing community.